Kaihong Hou

机构：National University of Defense Technology · ORCID：0000-0003-0317-8982

发表论文 14 篇 · 总被引 61 次 · h-index 5

代表论文

• Pumping and shrinking deformation of TSV-Cu under thermal cycling loads: A cross-scale analysis approach (2025 · Materials Science in Semiconductor Processing · 被引 16)
• Multi-crack spatial propagation evolution analysis of 3D-TSV under thermal-electric-mechanical coupling field (2024 · Materials Science in Semiconductor Processing · 被引 10)
• Evolution analysis of mechanical behaviours of through‑silicon via under thermal cycling load (2025 · Microelectronics Reliability · 被引 8)
• Analysis of Thermal Expansion Behavior and Interface Evolution of TSV Under Thermal Cycle Loading Based on Crystal Plastic Finite Element Method (2024 · IEEE Transactions on Device and Materials Reliability · 被引 7)
• Dimension Influence on the Interface Fatigue Characteristics of Three-Dimensional TSV Array: A Fully Coupled Thermal-Electrical-Structural Analysis (2024 · IEEE Transactions on Device and Materials Reliability · 被引 6)
• Research on environmental adaptability of AI-based visual perception system under the perspective of vibration (2023 · Expert Systems with Applications · 被引 4)