Evolution analysis of mechanical behaviours of through‑silicon via under thermal cycling load

作者：Kaihong Hou, Zhengwei Fan, Xun Chen, Shufeng Zhang, Yashun Wang, Yu Jiang · 发表于：Microelectronics Reliability · 年份：2025 · DOI：10.1016/j.microrel.2025.115647 · 被引用次数：8 · 研究领域：Microstructure and mechanical properties、Advanced Surface Polishing Techniques、Aluminum Alloys Composites Properties