Shufeng Zhang

机构：Xinjiang Academy of Agricultural Sciences · ORCID：0000-0002-9252-2986

发表论文 136 篇 · 总被引 1208 次 · h-index 19

代表论文

• Pumping and shrinking deformation of TSV-Cu under thermal cycling loads: A cross-scale analysis approach (2025 · Materials Science in Semiconductor Processing · 被引 16)
• Interfacial shear behavior of PBL deeply embedded in UHPC considering end-bearing effect (2024 · Journal of Constructional Steel Research · 被引 12)
• Multi-crack spatial propagation evolution analysis of 3D-TSV under thermal-electric-mechanical coupling field (2024 · Materials Science in Semiconductor Processing · 被引 10)
• Evolution analysis of mechanical behaviours of through‑silicon via under thermal cycling load (2025 · Microelectronics Reliability · 被引 8)
• Analysis of Thermal Expansion Behavior and Interface Evolution of TSV Under Thermal Cycle Loading Based on Crystal Plastic Finite Element Method (2024 · IEEE Transactions on Device and Materials Reliability · 被引 7)
• Failure analysis of unidirectional fiber reinforced plastics based on computational micromechanics and PUCK failure theory (2024 · Mechanics of Materials · 被引 6)