Pumping and shrinking deformation of TSV-Cu under thermal cycling loads: A cross-scale analysis approach

作者：Zhengwei Fan, Kaihong Hou, Yonggui Chen, Shufeng Zhang, Yashun Wang, Xun Chen · 发表于：Materials Science in Semiconductor Processing · 年份：2025 · DOI：10.1016/j.mssp.2025.109430 · 被引用次数：16 · 研究领域：3D IC and TSV technologies、Aluminum Alloys Composites Properties、Advanced ceramic materials synthesis