Zhengwei Fan

机构：Zhengzhou University · ORCID：0000-0002-4975-2161

发表论文 64 篇 · 总被引 545 次 · h-index 13

代表论文

• Pumping and shrinking deformation of TSV-Cu under thermal cycling loads: A cross-scale analysis approach (2025 · Materials Science in Semiconductor Processing · 被引 16)
• Multi-crack spatial propagation evolution analysis of 3D-TSV under thermal-electric-mechanical coupling field (2024 · Materials Science in Semiconductor Processing · 被引 10)
• Evolution analysis of mechanical behaviours of through‑silicon via under thermal cycling load (2025 · Microelectronics Reliability · 被引 8)
• Analysis of Thermal Expansion Behavior and Interface Evolution of TSV Under Thermal Cycle Loading Based on Crystal Plastic Finite Element Method (2024 · IEEE Transactions on Device and Materials Reliability · 被引 7)
• Synthesis analysis of the morphologies of convex polygonal tubular origami structures based on Yoshimura origami patterns (2023 · Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science · 被引 7)
• A review of modelling and data analysis methods for accelerated test (2025 · Journal of Reliability Science and Engineering · 被引 6)