Multi-crack spatial propagation evolution analysis of 3D-TSV under thermal-electric-mechanical coupling field

作者：Kaihong Hou, Zhengwei Fan, Yonggui Chen, Shufeng Zhang, Yashun Wang, Xun Chen · 发表于：Materials Science in Semiconductor Processing · 年份：2024 · DOI：10.1016/j.mssp.2024.109128 · 被引用次数：10 · 研究领域：3D IC and TSV technologies、Advanced Surface Polishing Techniques、Electronic Packaging and Soldering Technologies