Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature

作者：Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hidetoshi Hirahara, Jing Sang, Sung hun Cho, Tohru Sekino, Katsuaki Suganuma · 发表于：Composites Part B Engineering · 年份：2023 · DOI：10.1016/j.compositesb.2023.110562 · 被引用次数：42 · 研究领域：Electronic Packaging and Soldering Technologies、High voltage insulation and dielectric phenomena、Fiber-reinforced polymer composites