Chuantong Chen

机构：Museum of Japanese Art Yamato Bunkakan, The University of Osaka · ORCID：0000-0002-2365-4387

发表论文 295 篇 · 总被引 4986 次 · h-index 41

代表论文

Low-temperature copper sinter-joining technology for power electronics packaging: A review (2024 · Journal of Materials Processing Technology · 被引 83)
Driving forces of solid-state Cu-to-Cu direct bonding suppressing the work-hardening loss by refill friction stir spot welding (2024 · Materials Science and Engineering A · 被引 12)
Quartet structure generation set algorithm based 3D reconstruction on porous structures of sintered copper joints for power electronics packaging (2025 · Scripta Materialia · 被引 9)
Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition (2024 · Materials & Design · 被引 9)
Microstructure characteristics for improved thermal shock reliability of sintered Ag Al paste in SiC power module (2024 · Materials Characterization · 被引 7)
Metastable phases of Ag–Si: amorphous Si and Ag-nodule mediated bonding (2024 · Scientific Reports · 被引 7)