Motoharu Haga

机构：Daicel (Japan)

发表论文 20 篇 · 总被引 130 次 · h-index 6

代表论文

• Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature (2023 · Composites Part B Engineering · 被引 42)
• Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors (2022 · Applied Surface Science · 被引 22)
• Design and fabrication of a microcoil metamaterial absorber for the sub-terahertz region (2023 · Optics Letters · 被引 19)
• Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate (2023 · Microelectronics Reliability · 被引 19)
• Effects of high temperature and high humidity on the reliability of copper/epoxy bond (2024 · Applied Surface Science · 被引 7)
• In-situ observation and simulation of the solidification process in soldering a small outline package with the Sn-Ag-Cu lead-free alloy (2003 · Journal of Electronic Materials · 被引 7)