Experimental research on performance degradation of TSV microstructure under thermal cycling, vibration and electrical stress

作者：Zhengwei Fan, Xun Chen, Yashun Wang, Yu Jiang, Shufeng Zhang · 发表于：Microelectronics Reliability · 年份：2022 · DOI：10.1016/j.microrel.2022.114643 · 被引用次数：24 · 研究领域：3D IC and TSV technologies、Electronic Packaging and Soldering Technologies、Additive Manufacturing and 3D Printing Technologies