Effects of multi-cracks and thermal-mechanical coupled load on the TSV reliability

作者：Zhengwei Fan, Xun Chen, Yu Jiang, Xingge Li, Shufeng Zhang, Yashun Wang · 发表于：Microelectronics Reliability · 年份：2022 · DOI：10.1016/j.microrel.2022.114499 · 被引用次数：35 · 研究领域：3D IC and TSV technologies、Electronic Packaging and Soldering Technologies、Additive Manufacturing and 3D Printing Technologies