Hui Deng

机构：Ministry of Education of the People's Republic of China, Dalian Medical University, Southern University of Science and Technology, Second Affiliated Hospital of Chongqing Medical University, West Anhui University, Anhui Normal University, Chongqing Medical University · ORCID：0000-0002-7116-7188

发表论文 205 篇 · 总被引 3601 次 · h-index 30

代表论文

• Review of physicochemical-assisted nanomanufacturing processes for wide-bandgap semiconductor wafers (2025 · International Journal of Machine Tools and Manufacture · 被引 13)
• Gas Cluster Ion Beam Smoothing Technique: A Review (2025 · Nanomanufacturing and Metrology · 被引 13)
• Conformal polishing of NiP grating microstructures using SiO2/Al2O3 mixed abrasive slurry (2025 · Precision Engineering · 被引 4)
• The Effect of H2O and CO2 on the Adsorption Behavior of H2 and CO on Hematite (2025 · Materials · 被引 3)
• Computational Wavefront Sensing on a Photonic Integrated Chip (2025 · Laser & Photonics Review · 被引 2)
• Mechanism study on nanometric finishing of copper by electrochemical polishing using sulfuric acid/methanol electrolyte (2025 · Surfaces and Interfaces · 被引 2)