Mechanism study on nanometric finishing of copper by electrochemical polishing using sulfuric acid/methanol electrolyte

作者：Xinquan Zhang, Jingtian Ye, Yongjie Zhang, Yuxi Xiao, Jun Yang, Hui Deng · 发表于：Surfaces and Interfaces · 年份：2025 · DOI：10.1016/j.surfin.2025.107597 · 被引用次数：2 · 研究领域：Advanced Surface Polishing Techniques、Advanced Machining and Optimization Techniques、Integrated Circuits and Semiconductor Failure Analysis