Survey of Chiplet Technology: SoC Architecture, Interconnect, EDA, and Advanced Packaging

作者：Hongwei Liu, Yuan Du, Bo Pu, Guojun Yuan, Yuhang Liu, Linji Zheng, Pengchao Wang, Yang An, Yu Li, Chao‐Tang Yu, Fei Guo, Xiaoteng Zhao, Xuqiang Zheng, He Sun, Yongfu Li, Shaolin Xiang, Qinfen Hao · 发表于：IEEE Journal on Emerging and Selected Topics in Circuits and Systems · 年份：2025 · 被引用次数：15 · 研究领域：Electronic Packaging and Soldering Technologies、3D IC and TSV technologies、VLSI and FPGA Design Techniques

Chiplet technology has emerged as a transformative approach in integrated circuit design. Although it has attracted significant attention recently, there has been limited effort dedicated to clearly defining its concept, terminology, composition, and evolution phases etc. This survey paper gives a formal definition by proposing chiplet terminology and composition, name it as a new design methodology, then analyze over 200 recent publications from both academia and industry to establish chiplet as a technology domain composed of four distinct fields: chiplet-based SoC architecture, interconnect, EDA tools, and advanced packaging. For each field composing chiplets, the paper traces the technology development, analyze challenges, outline the evolution trend and challenges. This survey aims to provides an in-depth examination of chiplet domain and each field’s progress, offering insights drawn from literature analysis to outline the current and emerging landscape of chiplet technology.