Yongfu Li

机构：Shanghai Jiao Tong University · ORCID：0000-0002-6322-8614

发表论文 295 篇 · 总被引 3090 次 · h-index 27

代表论文

• Survey of Chiplet Technology: SoC Architecture, Interconnect, EDA, and Advanced Packaging (2025 · IEEE Journal on Emerging and Selected Topics in Circuits and Systems · 被引 12)
• Review: Application and development of machine learning in semiconductor manufacturing for automated wafer map pattern recognition and classification (2025 · Integration · 被引 4)
• Phenology-Aware Machine Learning Framework for Chlorophyll Estimation in Cotton Using Hyperspectral Reflectance (2025 · Remote Sensing · 被引 4)
• A 64.7 nA, –65dB@1 kHz, and Dual-Output CMOS Voltage Reference With Multi-Loop Active Load Without Trimming (2025 · IEEE Transactions on Circuits & Systems II Express Briefs · 被引 3)
• A Reference Oversampling PLL With a FoM REF of −240.1 dB Enabled By a Capacitive Parasitic-Proof Ring Oscillator and a Time-Multiplexed Gm Stage (2025 · IEEE Transactions on Circuits and Systems I Regular Papers · 被引 3)
• A Compact Cost-Effective NB-IoT System-in-Package With Integrated RF Front-End IPD and TX/RX Gain Self-Calibration (2025 · IEEE Transactions on Circuits and Systems I Regular Papers · 被引 2)