Controlled interfacial debonding based on laser induced deformation-impact coupling effect for advanced packaging

作者：Chenghao Ma, Fangcheng Wang, Huijuan Liu, Qiang Liu, Wenxue Dai, Mingqi Huang, Guoping Zhang, Rong Sun · 发表于：Applied Surface Science · 年份：2025 · DOI：10.1016/j.apsusc.2025.165350 · 被引用次数：3 · 研究领域：3D IC and TSV technologies、Laser Material Processing Techniques、Advanced Surface Polishing Techniques