Fangcheng Wang

机构：Chinese Academy of Sciences, Shenzhen Institutes of Advanced Technology · ORCID：0000-0002-8603-2147

发表论文 42 篇 · 总被引 1027 次 · h-index 16

代表论文

• A popcorn-inspired strategy for compounding graphene@NiFe2O4 flexible films for strong electromagnetic interference shielding and absorption (2024 · Nature Communications · 被引 50)
• A Highly Compressible, Elastic, and Air‐Dryable Metallic Aerogels via Magnetic Field‐Assisted Synthesis (2022 · Advanced Functional Materials · 被引 50)
• Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications (2023 · Electronics · 被引 43)
• Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress (2022 · Advanced Materials Technologies · 被引 41)
• Self‐Adhesive Electronic Skin with Bio‐Inspired 3D Architecture for Mechanical Stimuli Monitoring and Human‐Machine Interactions (2024 · Small · 被引 27)
• Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages (2022 · ACS Applied Polymer Materials · 被引 26)