Rational utilization of the size and electronic effect of inhibitors enabling high polishing rate with minimum corrosion in copper chemical mechanical polishing

作者：Pengfei Chang, Zisheng Huang, Yulong Chen, Huiqin Ling, Yunwen Wu, Ming Li, Yosi Shacham‐Diamand, Tao Hang · 发表于：Applied Surface Science · 年份：2024 · DOI：10.1016/j.apsusc.2024.160919 · 被引用次数：18 · 研究领域：Corrosion Behavior and Inhibition、Advanced Surface Polishing Techniques、Metal Extraction and Bioleaching