The influence of pH and H2O2 on surface quality and material removal rate during W-CMP

作者：Lin Wang, Feng Peng, Hongyu Chen, Wei Hang, Cuiping Yu, Shunhua Chen, Shijun Zhao, Zhenggang Wu, Yi Ma, Binghai Lyu, Julong Yuan · 发表于：The International Journal of Advanced Manufacturing Technology · 年份：2023 · DOI：10.1007/s00170-023-11805-3 · 被引用次数：25 · 研究领域：Advanced Surface Polishing Techniques、Advanced materials and composites、Advanced machining processes and optimization