Far End Crosstalk Mitigation of Differential High Speed Interconnects Within Printed Circuit Board Via Fields

作者：Junyan Tang, Xianbo Yang, Jose A. Hejase, Mahesh Bohra, Yanyan Zhang, Xiaomin Duan, Dierk Kaller, Dale Becker, Daniel Dreps · 年份：2021 · DOI：10.1109/epeps51341.2021.9609151 · 被引用次数：5 · 研究领域：Electromagnetic Compatibility and Noise Suppression、3D IC and TSV technologies、Electronic Packaging and Soldering Technologies

Tightly pitched differential viass and associated differential striplines that travel through those tight via regions in print circuit boards are prone to high levels of crosstalk. This work investigates the far end crosstalk behavior from the via region and the pin area wiring and shows that crosstalk cancellation or mitigation can be achieved by super positioning crosstalk from these two sections. Electromagnetic modelling and signal integrity analysis are carried out to demonstrate that crosstalk cancellation can be done by controlling the length of the pin area wiring as well as other printed circuit board design properties.