Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions

作者：Jing Wang, Ruiyang Liu, Dapeng Liu, Seungbae Park · 发表于：Microelectronics Reliability · 年份：2017 · DOI：10.1016/j.microrel.2017.04.018 · 被引用次数：31 · 研究领域：Numerical methods in engineering、Electronic Packaging and Soldering Technologies、Composite Material Mechanics