Seungbae Park

机构：Binghamton University, Hyundai Heavy Industries (South Korea) · ORCID：0000-0001-8498-266X

发表论文 192 篇 · 总被引 3743 次 · h-index 31

代表论文

• Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review (2024 · Microelectronics Reliability · 被引 75)
• Reflow Recipe Establishment Based on CFD-Informed Machine Learning Model (2023 · IEEE Transactions on Components Packaging and Manufacturing Technology · 被引 26)
• Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV) (2024 · 被引 17)
• Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods (2022 · 被引 15)
• Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded (2024 · IEEE Transactions on Components Packaging and Manufacturing Technology · 被引 13)
• Enhanced solder fatigue life of chip resistor by optimizing solder shape (2023 · Microelectronics Reliability · 被引 12)