Planarized aluminum metallization for sub-0.5 mu m CMOS technology

作者：F.S. Chen, Yi Lin, Girish Dixit, R. Sundaresan, C.C. Wei, F.T. Liou · 年份：2002 · DOI：10.1109/iedm.1990.237228 · 被引用次数：15 · 研究领域：Semiconductor materials and devices、Copper Interconnects and Reliability、Electronic Packaging and Soldering Technologies

The authors describe an aluminum sputter process, called the Al-plug process, which results in complete filling of submicron contacts and vias of various sizes. The process can be done in a conventional sputtering system. Material and electrical characterization of the film and the implementation of this process in submicron integrated circuits are presented.>