Yi Shi

发表论文 6 篇 · 总被引 19 次 · h-index 2

代表论文

• 3D Heterogeneous Integration with Sub-3μm Bond Pitch Chip-to-Wafer Hybrid Bonding (2024 · Electronic Components and Technology Conference · 被引 14)
• Process Development and Performance Benefits of 0.64-0.36 μm Pitch Hybrid Bonding on Intel Process (2024 · Electronic Components and Technology Conference · 被引 10)
• Mid-BEOL Heterogeneous Integration Through Sub-1um Pitch Hybrid Bonding & Advanced Silicon Carrier Technologies for AI & Compute Applications (2025 · Electronic Components and Technology Conference · 被引 5)
• Hybrid Bonding with Fluidic Self Alignment: Process Optimization and Electrical Test Vehicle Fabrication (2025 · Electronic Components and Technology Conference · 被引 2)
• Thermal Behavior of Hybrid Bonding Interfaces in Advanced Packaging Technologies (2026 · Electronic Components and Technology Conference)
• A Study of Chiplet Distortion in Chip-to-Wafer (C2W) Hybrid Bonding (2026 · Electronic Components and Technology Conference)