Tushar Talukdar

发表论文 10 篇 · 总被引 24 次 · h-index 3

代表论文

IR Laser Debond From Silicon Carrier Wafers With Inorganic Thin Film Release Layers for High-Density 2.5D and 3D Integration (2024 · Electronic Components and Technology Conference · 被引 11)
Process Development and Performance Benefits of 0.64-0.36 μm Pitch Hybrid Bonding on Intel Process (2024 · Electronic Components and Technology Conference · 被引 10)
Organic Interposers Using Zero-Misalignment-Via Technology and Silicon Wafer Carriers for Large Area Wafer-Level Package Applications (2024 · Electronic Components and Technology Conference · 被引 6)
Mid-BEOL Heterogeneous Integration Through Sub-1um Pitch Hybrid Bonding & Advanced Silicon Carrier Technologies for AI & Compute Applications (2025 · Electronic Components and Technology Conference · 被引 5)
Selective Layer Transfer: Industry First Heterogeneous Integration Technology Enabling Ultra-Fast Assembly & Sub-1um Chiplet Thickness for Next Generation AI & Compute Applications (2024 · International Electron Devices Meeting · 被引 4)
IR Laser Debond Process Modeling (2026 · Electronic Components and Technology Conference)