A. Elsherbini

发表论文 10 篇 · 总被引 88 次 · h-index 4

代表论文

• Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process (2022 · International Electron Devices Meeting · 被引 53)
• Enabling Hybrid Bonding on Intel Process (2021 · International Electron Devices Meeting · 被引 25)
• IR Laser Debond From Silicon Carrier Wafers With Inorganic Thin Film Release Layers for High-Density 2.5D and 3D Integration (2024 · Electronic Components and Technology Conference · 被引 11)
• Process Development and Performance Benefits of 0.64-0.36 μm Pitch Hybrid Bonding on Intel Process (2024 · Electronic Components and Technology Conference · 被引 10)
• Mid-BEOL Heterogeneous Integration Through Sub-1um Pitch Hybrid Bonding & Advanced Silicon Carrier Technologies for AI & Compute Applications (2025 · Electronic Components and Technology Conference · 被引 5)
• Enabling Chip-To-Wafer Hybrid Bonding Scaling to 1Um Pitch With Optimal Power Delivery Using New Bond Via Architectures (2025 · Electronic Components and Technology Conference · 被引 4)