Xiaofu Wei

机构：Hohai University, University of Washington, Beijing University of Technology, Advanced Technology & Materials (China), Beijing Academy of Science and Technology, University of Science and Technology Beijing

发表论文 32 篇 · 总被引 1390 次 · h-index 12

代表论文

• Gradient‐Strained Van Der Waals Heterojunctions for High‐Efficient Photodetectors (2024 · Advanced Functional Materials · 被引 56)
• Homojunction-loaded inverters based on self-biased molybdenum disulfide transistors for sub-picowatt computing (2024 · Nature Electronics · 被引 56)
• High-Spike Barrier Photodiodes Based on 2D Te/WS 2 Heterostructures (2024 · ACS Nano · 被引 31)
• Universal transfer of full‐class metal electrodes for barrier‐free two‐dimensional semiconductor contacts (2023 · InfoMat · 被引 26)
• Atomic layer bonding contacts in two-dimensional semiconductors (2025 · Science · 被引 23)
• Two-dimensional transition metal dichalcogenides for post-silicon electronics (2023 · National Science Open · 被引 23)