Haidong Yan

机构：Institute of Semiconductors, Guilin University of Electronic Technology, Zhejiang University of Technology, Zhejiang University

发表论文 53 篇 · 总被引 414 次 · h-index 11

代表论文

• Low-temperature copper sinter-joining technology for power electronics packaging: A review (2024 · Journal of Materials Processing Technology · 被引 79)
• Advanced Packaging Technology of GaN HEMT Module for High-Power and High-Frequency Applications: A Review (2024 · IEEE Transactions on Components Packaging and Manufacturing Technology · 被引 19)
• Characterization of Multiple Commercial Sintered-Silver Pastes as Die Attachment for Power Electronics Packaging: Materials, Processing, and Properties (2024 · IEEE Journal of Emerging and Selected Topics in Power Electronics · 被引 12)
• High-Performance 10-kV-Rated, 175-mΩ 4H-SiC MOSFETs With MeV JFET Implantation and Efficient Termination (2025 · IEEE Transactions on Electron Devices · 被引 7)
• Strengthening mechanism of electroplated Cu layer on sintered Cu joint (2025 · Journal of Materials Research and Technology · 被引 5)
• Aging and Sintered Layer Defect Detection of Discrete MOSFETs Using Frequency Domain Reflectometry Associated With Parasitic Resistance (2024 · IEEE Transactions on Device and Materials Reliability · 被引 5)