Guanhua Yang

机构：Chinese Academy of Sciences, Chinese Academy of Engineering, Institute of Microelectronics, China Railway Economic and Planning Research Institute, Institute of Microelectronics, Beijing Urban Construction Design & Development Group (China), Beijing Transportation Research Center · ORCID：0000-0003-4694-7040

发表论文 151 篇 · 总被引 3495 次 · h-index 30

代表论文

• Removal mechanisms and damage evolution in unidirectional Cf/SiC composites during 2D ultrasonic vibration-assisted grinding with a single diamond abrasive particle (2025 · Journal of Manufacturing Processes · 被引 20)
• High-density three-dimensional integration of dynamic random-access memory using vertical dual-gate IGZO TFTs (2025 · Nature Communications · 被引 11)
• Subthreshold Schottky-barrier transistor based on monolayer molybdenum disulfide (2025 · Nature Communications · 被引 4)
• Modeling of grinding forces and anisotropic damage in single abrasive grain 2D ultrasonic vibration-assisted grinding of Cf/SiC composites (2025 · Journal of the European Ceramic Society · 被引 4)
• Design, flow characteristics and thermal performance analysis of TPMS-based heat exchangers with SC2-FCC arrangement (2025 · International Communications in Heat and Mass Transfer · 被引 3)
• In–Ga ratio-dependent positive bias stress stability in InGaO based thin-film transistors (2025 · Applied Physics Letters · 被引 2)