Per Eklund

机构：Linköping University, Uppsala University, Institute of Inorganic Chemistry of the Slovak Academy of Sciences, Thinfilm (Sweden) · ORCID：0000-0003-1785-0864

发表论文 483 篇 · 总被引 24173 次 · h-index 70

代表论文

• The effect of stress on thermoelectric properties of flexible Mg3Bi2 thin films (2025 · Applied Physics Letters · 被引 5)
• The Role of 11 B 4 C Interlayers in Enhancing Fe/Si Multilayer Performance for Polarized Neutron Mirrors (2025 · The Journal of Physical Chemistry C · 被引 3)
• Engineering Electrical Transport by Implantation‐Induced Defects in CrN Films Without Affecting Thermal Conductivity (2025 · Advanced Materials Interfaces · 被引 2)
• Morphology-Engineered Nanostructured Silver- and Antimony-Telluride Films for Flexible Thermoelectric Generators (2026 · ACS Applied Energy Materials · 被引 1)
• Defect Engineering in Ti‐Doped Ta 3 N 5 Thin Films for Enhanced Photoelectrochemical Water Splitting: Electronic Structure Modulation and Charge Carrier Dynamics (2025 · Small Structures · 被引 1)
• Low-temperature synthesis of Al-rich rock salt Cr1−xAlxN films with selective metal ion bombardment by synchronized substrate bias pulsing (2025 · Applied Physics Letters · 被引 1)