John Hon-Shing Lau

机构：Hong Kong University of Science and Technology, Micron Corporation (United States) · ORCID：0000-0003-1284-8829

发表论文 581 篇 · 总被引 14109 次 · h-index 55

代表论文

Recent Advances and Trends in Cu–Cu Hybrid Bonding (2023 · IEEE Transactions on Components Packaging and Manufacturing Technology · 被引 135)
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging (2023 · Journal of Electronic Packaging · 被引 77)
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers (2023 · IEEE Transactions on Components Packaging and Manufacturing Technology · 被引 74)
Chiplet Design and Heterogeneous Integration Packaging (2023 · 被引 62)
Current Advances and Outlooks in Hybrid Bonding (2025 · IEEE Transactions on Components Packaging and Manufacturing Technology · 被引 60)
State of the Art of Cu–Cu Hybrid Bonding (2024 · IEEE Transactions on Components Packaging and Manufacturing Technology · 被引 53)