Bessel Picosecond Laser Cutting Glass-Ceramics: Optimization of Processing Point Spacing, Incident Power, and Burst Mode

作者：Xinjian Pan, Yunfei Duan, Yi Song, Cheng Peng, Jinxuan Li, Zhili Li, Chunjian Deng, Jianjun Yang, Qingguo Gao, Zhi Zhang, Yi Cai · 发表于：Applied Sciences · 年份：2025 · DOI：10.3390/app15116172

Recent advances in glass-ceramics research have expanded their applications in astronomy, optoelectronics, and laser systems. However, precision cutting technology remains challenging. This study optimized picosecond laser processing parameters for 600 nm-thick glass-ceramics, revealing critical influences of point spacing, laser energy, and pulse number. Atomic force microscopy showed that 1 µm processing spacing enabled uniform ablation grooves with optimal roughness. Two-pulse configurations achieved the most consistent surface improvement. At 12.5 W incident power, samples exhibited minimized average roughness (219 nm) with localized values reaching 208 nm, alongside 1.2 N breaking stress.