Digital Twin Emulation of a Hartley Oscillator Circuit for EMI and Thermal Mitigation of Semiconductor Device Packages

作者：Arnaldo J. Sans, Anthony Perez-Pinon, G. Al-Duhni, Wilfredo Rivas-Torres, M. Pulugurtha, J. Volakis · 发表于：2025 IEEE CNC-USNC-URSI North American Radio Science Meeting (Joint with AP-S Symposium) · 年份：2025 · DOI：10.23919/cnc-usnc-ursi64444.2025.11419960

Higher manufacturing yields for higher density and higher data speed heterogeneous electronics imply Electromagnetic Interference (EMI) challenges. As an example, the realization of simple Hartley oscillator circuits require the packaging of passive components with an active device. Oscillatory circuits, like the Hartley oscillator, are well behaved at room temperature with acceptable margins. However, as the components are more densely packaged, there is Electromagnetic Interference (EMI) on the oscillator circuit, leading to a phase lock loop instability that must be addressed.