Leveraging thermally-aware chiplet organization in 2.5D systems to reclaim dark silicon

作者：Furkan Eris, A. Joshi, A. Kahng, Yenai Ma, Saiful A. Mojumder, Tiansheng Zhang · 发表于：Design, Automation and Test in Europe · 年份：2018 · DOI：10.23919/DATE.2018.8342238 · 被引用次数：30 · 研究领域：Computer Science