Rheology-Optimized Photosensitive Ceramic Paste Based on P(MMA- co -MAA) for High-Resolution Photolithography of Low-Temperature Co-Fired Ceramic Vias

作者：Xiaoxuan Wang, Kewen Tao, X Y Liu, Xinyu Wang, Xiulin Dong, Cunxin Li, Yuanjian Sun, Yiming Wang, Mingwei Wang, Li Li, Xuhong Guo · 发表于：ACS Applied Polymer Materials · 年份：2026 · DOI：10.1021/acsapm.6c01214 · 研究领域：Electrical and Thermal Properties of Materials、3D IC and TSV technologies、Microwave Dielectric Ceramics Synthesis

The fabrication of through-vias in low-temperature co-fired ceramic (LTCC) substrates is limited by the poor resolution, low efficiency, and high cost of conventional laser drilling and mechanical punching. Here, a photosensitive ceramic paste (PSCP) based on a molecularly tailored poly(methyl methacrylate- co -methacrylic acid) (P(MMA- co -MAA)) prepolymer is developed through combined polymer design and rheological engineering to enable high-resolution photolithographic patterning. By optimizing the MMA/MAA molar ratio to 4:1, the photosensitive resin achieves a pattern resolution of 5.47 μm. A P(MMA- co -MAA) content of 30 wt % provides an optimal viscoelastic balance for uniform spin-coating, while incorporation of 50 wt % ceramic solids forms a stable composite network that ensures pattern fidelity during exposure and development. As a result, vias with a minimum diameter of 31.90 μm and steep sidewalls are obtained at a low exposure dose of 20 mJ/cm 2, outperforming a commercial benchmark paste in both resolution and sidewall verticality. This work establishes a practical materials and rheology design strategy for high-resolution photolithography patterning in high-solid-loading ceramic systems, paving the way for advanced LTCC and related electronic packaging technologies.