Research on performance degradation of through-silicon via interconnect structures based on irreversible entropy

作者：X. Xu, Juan Ma, Anas W. Alshawawreh, Lu Liu, Peter Wriggers, Michael Beer, Muazzam A. Khan Khattak · 发表于：Computational Mechanics · 年份：2026 · DOI：10.1007/s00466-026-02764-z · 被引用次数：1 · 研究领域：3D IC and TSV technologies、Electronic Packaging and Soldering Technologies、Copper Interconnects and Reliability