High-throughput screening and Cu-content-driven optimization of properties in Cux(CoCrFeNi)100-x high-entropy alloys

作者：Jiasheng Wang, Yuxin Wen, Jianzhong Jiang, Peter K. Liaw, Guihong Geng, Yong Zhang · 发表于：Journal of Materials Research and Technology · 年份：2026 · DOI：10.1016/j.jmrt.2026.02.135 · 被引用次数：6 · 研究领域：High Entropy Alloys Studies、Additive Manufacturing Materials and Processes、Advanced materials and composites

Optimizing the balance between mechanical and electrical properties remains a critical challenge for Cu-containing high-entropy alloys (HEAs), due to the complex and often competing effects of Cu on microstructure and deformation behavior. In this work, a high-throughput film screening strategy was employed to systematically investigate the influence of Cu content on the microstructure, mechanical properties, and electrical resistivity of Cu x (CoCrFeNi) 100-x HEAs over a wide compositional range. The film results reveal that Cu content plays a dominant role in regulating grain morphology, lattice distortion, nano-hardness, and electrical resistivity, with several non-monotonic responses indicating distinct transition regimes. Based on these composition-driven trends, five representative compositions spanning Cu-poor, intermediate, and Cu-rich regimes were selected for bulk alloy fabrication to further evaluate mechanical strength, ductility, and wear resistance under realistic solidification conditions. The bulk alloys exhibit a Cu-induced dual-phase FCC structure, accompanied by a progressive transition from strength-dominated behavior to enhanced ductility and wear resistance with increasing Cu content. Among the investigated compositions, the alloy containing ∼30 at.% Cu achieves the optimal combination of yield strength (282.86 MPa), tensile strength (423.58 MPa), and ductility (25.2%), while higher Cu contents significantly reduce wear rates by promoting oxidative wear ...