Challenges and Opportunities in PFAS Waste Management for Semiconductor Manufacturing

作者：Devashish Gokhale, Gabriel Antonio Cerrón-Calle, Mitchell L. Kim-Fu, Kenneth Flores, Anaira Román Santiago, Shao-Wei Tsai, Diana S. Aga, Nirupam Aich, Mamadou S. Diallo, Kyle Doudrick, David Hanigan, Raúl Hernández Sánchez, John Howarter, Jianbing Jiang, Gerrad D. Jones, Linda S. Lee, Haizhou Liu, Katherine E. Manz, Erica R. McKenzie, Lokesh P. Padhye, R. Mohan Sankaran, Scott M. Shepard, Timothy J. Strathmann, Arjun K. Venkatesan, Michael S. Wong, Robert Leet, David Speed, Jennifer A. Field, Paul Westerhoff, Xiao Su · 发表于：Environmental Science & Technology · 年份：2026 · DOI：10.1021/acs.est.5c10109 · 被引用次数：13 · 研究领域：Per- and polyfluoroalkyl substances research、Effects and risks of endocrine disrupting chemicals、Fluoride Effects and Removal

Abstract Semiconductor manufacturing is rapidly expanding alongside tightening environmental regulations and increasing public concern around per- and polyfluoroalkyl substances (PFAS). Because of their unique chemical properties, PFAS are used across numerous processes in semiconductor manufacturing. Given process complexity and lengthy development timelines for alternatives, eliminating PFAS use in this industry is not currently feasible. Developing practical technologies for PFAS waste management is therefore critical but uniquely challenging in semiconductor manufacturing due to the nature of waste streams (parts-per-billion PFAS concentrations, complex backgrounds including hundreds of chemicals, prevalence of ultrashort PFAS, total stream volumes up to 35,000 m3 per day per facility, and distribution across gas, liquid, and solid phases) and significant constraints on space and systems redesign. This review describes recent developments and key questions that must be addressed to develop impactful and commercially viable detection and abatement methods for PFAS waste management in semiconductor manufacturing. Integrating these technologies into compact, high-performance systems and testing them under realistic conditions (complex PFAS mixtures, high fluoride/ionic strength, pH 6–11, low contact time, process variability) through industrial collaborations is essential for scalable, cost-effective solutions. Research addressing semiconductor industry-specific PFAS waste i...