Thermal, electrical, and mechanical properties of pure copper fabricated by semi‐solid additive manufacturing

作者：Yuting Zhao, Siyu Yan, Rongshan Lü, Zemin Wang · 发表于：Additive Manufacturing Frontiers · 年份：2025 · DOI：10.1016/j.amf.2025.200279 · 被引用次数：2 · 研究领域：Additive Manufacturing Materials and Processes、Advanced Welding Techniques Analysis、Aluminum Alloys Composites Properties

With advancements in the power electronics industry, the demand for structurally complex copper components presents substantial challenges to conventional manufacturing. Semi-solid deposition molding (SDM) has attracted considerable attention owing to its wide application range, low residual stress, and cost-effectiveness. In this study, SDM was used to fabricate copper green parts. The degreasing and sintering processes were investigated by optimizing the process window to probe the changes in porosity and microstructure of the parts. In addition, based on the atomic diffusion mechanism, a model correlating thermal conductivity, electrical conductivity, mechanical properties, and porosity was developed and used to predict the thermal and electrical properties of the fabricated copper samples. The experimental results revealed that the relative density of SDM-formed copper reached 98.70% under optimal printing parameters (0.575 mm for contour and print scanning, 0.2 mm for layer thickness, and 180°C for nozzle temperature). The highest thermal conductivity of 334.6 W/m·K and electrical conductivity of 47.91×10 6 S/m were obtained for specimens sintered at 1050°C for 4 h. The highest tensile and yield strengths were 182.8 MPa and 75.8 MPa, respectively.