Fabrication of High-Resolution Active Matrix Micro-LED Display Based on Direct Laser Mass Transfer

作者：Zhu Yang, Wenya Tian, Jianxin Wang, Yang Shi, Yuanhao Sun, Min Wu, Guoxu Fang, Haojie Zhou, Xiaoxiao Ji, Xiuzhen Lu, Ming Chen, Luqiao Yin, Jianhua Zhang · 发表于：ACS Photonics · 年份：2025 · DOI：10.1021/acsphotonics.5c01743 · 被引用次数：6 · 研究领域：Advanced optical system design、Nanomaterials and Printing Technologies、3D IC and TSV technologies

Mass transfer technology represents a critical bottleneck limiting the mass production of large-sized micro-LED displays. This study proposes a high-resolution direct laser mass transfer process utilizing a receiving tape, successfully fabricating a 3.8 in. 1280 × 1024 green active matrix micro-LED display with 431 PPI and 58.88 μm pixel pitch. The receiving tape with excellent adhesion, high-temperature fluidity, and chip-catching capability was prepared via anionic polymerization and a comma scraping roller process. The micro-LED chips were directly transferred from the chips on the wafer (CoW) to the thin-film transistor (TFT) backplane using a 248 nm KrF excimer laser, significantly simplifying the transfer process. Combined with a flexible laminated bonding structure, high-precision transfer and high-yield thermocompression bonding of the micro-LED array to the TFT backplane were achieved, achieving an illumination yield of 99.39%. Comprehensive analyses were conducted on the morphology of the transferred chips, the bonding interface of the bonded chips, and the key optical performance parameters. The process developed herein provides a scalable solution for the large-scale manufacturing of micro-LED displays, holding significant potential to accelerate the commercialization of micro-LED technology.