Multiscale filler network design enables solid–liquid reversible thermal interface materials with high thermal conductivity and low thermal resistance

作者：Jiahui Wang, Shujun Cai, Yujie Ma, Jianbin Xu, Jianfeng Fan, Xiaoliang Zeng, Rong Sun · 发表于：Composites Part A Applied Science and Manufacturing · 年份：2025 · DOI：10.1016/j.compositesa.2025.109422 · 被引用次数：5 · 研究领域：Thermal properties of materials、Advanced ceramic materials synthesis、Aerogels and thermal insulation