Hot deformation behavior, processing map and dynamic recrystallization mechanisms of Cu–Te alloy

作者：Qianqian Fu, Meirong Lei, Bing Li, Mengxiao Zhang, Hongwu Song, Renguo Guan · 发表于：Materials Characterization · 年份：2025 · DOI：10.1016/j.matchar.2025.115765 · 被引用次数：7 · 研究领域：Metallurgy and Material Forming、Microstructure and mechanical properties、Solidification and crystal growth phenomena