Shape-engineered silver nanoparticles toward high-strength interconnects in electronic packaging

作者：Jin Yang, Haonan Dong, Zhe Huang, Jinhua Qin, Baishan Chen, Siwei Tang, Yunzhu Ma, Wensheng Liu · 发表于：Journal of Materials Science Materials in Electronics · 年份：2025 · DOI：10.1007/s10854-025-16100-3 · 被引用次数：2 · 研究领域：Electronic Packaging and Soldering Technologies、Nanomaterials and Printing Technologies、3D IC and TSV technologies