Molecular dynamics simulation of Mo Cu diffusion bonding mechanism based on NEP + ZBL potential function

作者：Haimei Han, Weijie Lin, Man Zhou, Chongtao Wei, Ping Zhang · 发表于：Computational Materials Science · 年份：2025 · DOI：10.1016/j.commatsci.2025.114340 · 被引用次数：2 · 研究领域：Welding Techniques and Residual Stresses、Advanced Welding Techniques Analysis、Advanced materials and composites