Optimization Design of Spaceborne Microstrip Array by Strain Compensation Method Based on Multi-Physics Coupling Analysis

作者：Kaihang Fan, Kui Huang, Qi Xiao, Shuting Wang, Hao Liu, Huilin Wang · 发表于：Electronics · 年份：2025 · DOI：10.3390/electronics14214255 · 被引用次数：2 · 研究领域：Antenna Design and Optimization、Structural Analysis and Optimization、Spacecraft Design and Technology

During orbital operations, spaceborne microstrip antennas are continuously exposed to solar radiation and the cold thermal sink of space, enduring extreme temperature variations. These extreme temperature variations induce significant thermal stress, which leads to deformation in spaceborne antennas, inevitably degrading their operational performance. To address this issue, an optimized design method for antenna array structure based on strain compensation is proposed in this paper. The proposed method uses the COMSOL Multiphysics 6.2 to analyze thermal-structural-electromagnetic coupling behavior of spaceborne microstrip arrays under extreme temperature conditions. The simulation quantifies the thermal-strain distribution. Accordingly, different slits are introduced in regions of high-strain concentration, effectively redistributing the strain to minimize thermal deformation. This optimized configuration maintains superior electrical performance while significantly enhancing thermal stability. Both simulation and measurement results verify the effectiveness of the proposed optimization design method. Notably, the proposed method offers a novel solution for mitigating thermal-induced performance degradation in spaceborne antenna systems without requiring active thermal control.