Electrodeposition of low-ordered Ni–W as a release layer for ultrathin Cu foils: experimental and theoretical insights

作者：Xuesong Peng, Fan Meng, Jie Jiang, Yaqiang Li, Guangzhao Wang, Ruopeng Li, Jialuo Lin, Longhao Zhu, Linghui Meng, Zongtai Wang, M. An · 发表于：Applied Surface Science · 年份：2025 · DOI：10.1016/j.apsusc.2025.164968 · 被引用次数：4 · 研究领域：Electrodeposition and Electroless Coatings、Semiconductor materials and interfaces、Electronic Packaging and Soldering Technologies