Chip Water-Cooled Plate Heat Dissipation Influence Factors Research

作者：Kunrui Cai, Zhiwei Huang, Kangming Peng · 发表于：Advances in transdisciplinary engineering · 年份：2025 · DOI：10.3233/atde250963 · 研究领域：Heat Transfer and Optimization

With the improvement of the chip computing power, the power of the chip also becomes larger, and the heat of the chip increases in the same proportion. Commonly used cooling methods are water cooling and air cooling, water cooling through the liquid to take the heat out of the heat emitter, air cooling through the air to take the heat out of the heat emitter. The role of chip water-cooling board heat dissipation is to dissipate the heat generated by the chip in time to ensure that the chip works at a normal temperature. In addition, this study adopts water-cooled plate heat dissipation to dissipate heat from the chip, and uses finite element analysis to analyse the factors that affect the heat of the chip water-cooled plate, and analyses the effects of the temperature of the heat source chip, the pressure and temperature of the inlet coolant, the temperature around the water-cooled plate, and the position of the heat source on the heat of the chip water-cooled plate. It is found that the heat dissipation effect is best when the heat source chip is close to the inlet and outlet of the water-cooling plate. The lower the coolant temperature, the higher the inlet pressure of the coolant, and the lower the ambient temperature around the water-cooling plate, the better the heat dissipation effect is.