Process development and integration of hybrid bonding for wafers with multi-type bonding pads

作者：Guoqiang Zhao, Yi Zhao · 发表于：Microelectronic Engineering · 年份：2025 · DOI：10.1016/j.mee.2025.112420 · 被引用次数：6 · 研究领域：3D IC and TSV technologies、Electronic Packaging and Soldering Technologies、Advanced Surface Polishing Techniques