Synergistic Chloride-Choline Bitartrate Strategy for Ultralight Copper Powders with Enhanced Mechanical Stability and Ultralow Apparent Density

作者：Youpo Mise, Shaohua Wang, Wenzhong Shi, Yakun Yin, Zejia Wang, Juan An, Xuejiao Zhou, Wentang Xia, Wenqiang Yang · 发表于：Journal of The Electrochemical Society · 年份：2025 · DOI：10.1149/1945-7111/ae0eb5 · 被引用次数：1 · 研究领域：Advanced materials and composites、Nanomaterials for catalytic reactions、Copper Interconnects and Reliability

This study developed a synergistic strategy using chloride ions (Cl − ) and choline bitartrate (CBT) as binary additives to address the longstanding trade-off between high specific surface area and structural stability in ultralight copper powders (UCPs). Multiscale electrochemical analyses and morphological characterization revealed that the Cl − -CBT pair modulated copper electrodeposition kinetics via dynamic coordination and interfacial adsorption, enabling control of dendritic growth. At a Cl − :CBT molar ratio of 1:1, the system promoted three-dimensional instantaneous nucleation, reduced charge transfer resistance by 27.3%, and constructed a fractal dendritic architecture with balanced branch density and structural integrity. This strategy mitigated excessive dendrite thinning and structural collapse and improved mechanical robustness. Under a benchmark factory process conditions, the synthesized UCP (P-Cl-CBT) exhibited ultralow apparent density (0.41 g cm −3 ), refined median particle size (D 50 , 44.25 μm), and enhanced process efficiency (3.3% higher current efficiency, 5.9% lower energy consumption). In vibration testing (24 h, 2.5 Hz, 20 mm amplitude), the fractal framework retained >95% structural integrity, with negligible changes in D 50 (Δ = −2.69%) and apparent density (Δ = +2.4%). Elemental and crystallographic analyses indicated negligible additive incorporation and preservation of the face-centered cubic (FCC) structure, consistent with high purity.