Failure analysis of direct plating copper (DPC) substrates under extreme heat resistance test

作者：Jinghui Zhang, Jiahao Liu, Lijin Qiu, Linlin Song, Zibin Huang, Lei Yao, Hongtao Chen, Xingxing Li, Mingyu Li · 发表于：Microelectronics International · 年份：2025 · DOI：10.1108/mi-11-2024-0308 · 被引用次数：1 · 研究领域：Advanced ceramic materials synthesis、Aluminum Alloys Composites Properties、Metal and Thin Film Mechanics

Purpose This study aims to investigate the failure mechanisms of direct plating copper (DPC) substrates, particularly the occurrence of surface bulging under extreme heat resistance test (≥350°C). In addition, some improvement measures have been proposed to suppress its failure phenomenon, which can provide reference for the application of DPC substrates in high temperature environments. Design/methodology/approach DPC substrates were subjected to extreme heat resistance test (≥350°C) to reproduce the bulging phenomenon. The mechanism of high-temperature heat resistance failure of DPC substrates was revealed through interface adhesion testing, scanning electron microscope and Energy Dispersive Spectrometer microscopic characterization and focused ion beam microscopic processing methods. Findings Under the extreme heat resistance test, the DPC substrate experienced bulging failure, and the interfacial bonding force decreased from 38.9 to 26.7 MPa. The main failure mechanism was the influence of abnormal S elements in DPC on copper corrosion, resulting a decrease in the adhesion strength between the Cu layer and the Ti layer. Due to the coefficient of thermal expansion mismatch between Cu and Al2O3 ceramics, the DPC substrate ultimately failed by bulging. In addition, some improvements were suggested including controlling the roughness of ceramic substrate, changing electroplating solution composition and adjusting thermal layout. Originality/value This study reveals the phenom...